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Create a company profilePicocom, the 5G open RAN baseband semiconductor and software specialist, designs and markets open RAN standard-compliant baseband SoCs and carrier-grade software products for 5G small cell infrastructure.
Graphcore has created a new processor, the Intelligence Processing Unit (IPU), specifically designed for artificial intelligence. The IPU’s unique architecture means developers can run current machine learning models orders of magnitude faster. More importantly, it lets AI researchers undertake entirely new types of work, not possible using current technologies, to drive the next great breakthroughs in general machine intelligence. Our next generation 3D Wafer-on-Wafer Bow IPU systems are helping AI innovators worldwide to build better, more innovative AI solutions, whether their focus is on language and vision, exploring graph neural networks and LSTMs or creating something entirely new. We believe our IPU technology will become the worldwide standard for artificial intelligence compute. The performance of Graphcore’s IPU is going to be transformative across all industries and sectors whether you are a medical researcher, roboticist or building autonomous cars. Our team is at the forefront of the artificial intelligence revolution, enabling innovators from all industries and sectors to expand human potential with technology. What we do, really makes a difference. We're always interested in hearing from exceptional people to join our team.
CEVA is the leading licensor of wireless connectivity and smart sensing technologies. We offer Digital Signal Processors, AI processors, wireless platforms and complementary software for sensor fusion, image enhancement, computer vision, voice input and artificial intelligence, all of which are key enabling technologies for a smarter, connected world. We partner with semiconductor companies and OEMs worldwide to create power-efficient, intelligent and connected devices for a range of end markets, including mobile, consumer, automotive, robotics, industrial and IoT. Our ultra-low-power IPs include comprehensive DSP-based platforms for 5G baseband processing in mobile and infrastructure, advanced imaging and computer vision for any camera-enabled device and audio/voice/speech and ultra-low power always-on/sensing applications for multiple IoT markets. For sensor fusion, our Hillcrest Labs sensor processing technologies provide a broad range of sensor fusion software and IMU solutions for AR/VR, robotics, remote controls, and IoT. For artificial intelligence, we offer a family of AI processors capable of handling the complete gamut of neural network workloads, on-device. For wireless IoT, we offer the industry’s most widely adopted IPs for Bluetooth (low energy and dual mode), Wi-Fi 4/5/6 (802.11n/ac/ax) and NB-IoT. Headquartered in Rockville, Maryland, CEVA has more than 380 employees worldwide, with design centers in Israel, Ireland, France, United Kingdom, United States and sales and support offices located in Europe, the U.S. and throughout Asia. To date, more than 11 billion CEVA-powered chips have been shipped worldwide, for a wide range of diverse end markets. CEVA was created through the combination of the DSP IP licensing division of DSP Group, Inc. and Parthus Technologies plc (“Parthus”) in November 2002.
At Cepro (formerly known as Clean Energy Prospector) we fund, construct and operate fully managed community microgrids that help Housebuilders deliver Net Zero carbon new build housing.
Icera has developed the world’s first market proven, high performance soft modem technology for mobile broadband phone and data devices. These include mobile broadband datacards and USB sticks, cellular modules for laptops and mobile internet devices (MIDs). In addition, Icera’s soft modem provides the ideal slim modem for high performance smartphones. Please visit www.icerasemi.com for more information.
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